Journal of the Korean Society for Precision Engineering (한국정밀공학회지)
- Volume 16 Issue 2 Serial No. 95
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- Pages.60-67
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- 1999
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- 1225-9071(pISSN)
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- 2287-8769(eISSN)
Selective Removal of Mask by Mechanical Cutting for Micro-patterning of Silicon
마스크에 대한 기계적 가공을 이용한 단결정 실리콘의 미세 패턴 가공
Abstract
Micro-fabrication techniques such as lithography and LIGA processes usually require large investment and are suitable for mass production. Therefore, there is a need for a new micro-fabrication technique that is flexible and more cost effective. In this paper a novel, economical and flexible method of producing micro-pattern on silicon wafer is presented. This method relies on selective removal of mask by mechanical cutting. Then micro-pattern is produced by chemical etching. V-shaped grooved of about 3