한국표면공학회지 (Journal of the Korean institute of surface engineering)
- 제32권6호
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- Pages.695-702
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- 1999
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- 1225-8024(pISSN)
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- 2288-8403(eISSN)
Cu(Mg) alloy의 비저항에 영향을 미치는 인자에 대한 연구
A study on the factors affecting Cu(Mg) alloy resistivity
초록
We have explored the factors affecting the resistivity of Cu (Mg) alloy, which was prepared by sputtering. The results show that the resistivity is a function of Mg content, annealing temperature, annealing time, and Cu-alloy thickness. Addition of Mg to copper increases the resistivity through solute scattering. In addition, increasing Mg content promotes the interfacial reaction between Mg and SiO
키워드