한국표면공학회지 (Journal of the Korean institute of surface engineering)
- 제32권4호
- /
- Pages.503-512
- /
- 1999
- /
- 1225-8024(pISSN)
- /
- 2288-8403(eISSN)
리플로 공정 후에 형성된 In과 Au/Ni/Ti 다층 박막의 계면 구조의 TEM 분석
The TEM Characterization of the Interfacial Microstructure between In Solder and Au/Ni/Ti Thin Films during Reflow Process
초록
The crystal structure and the microstructure of the intermetallic compounds formed in the interface between In solder and Au/Ni/Ti thin films have been investigated by XRD, SEM, and TEM. Indium solder was deposited on the Au/Ni/Ti thin films/Si substrate by evaporation. The heat treatments simulated the flip chip solder joining were performed in RTA system or in furnace.
키워드