한국표면공학회지 (Journal of the Korean institute of surface engineering)
- 제32권3호
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- Pages.211-213
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- 1999
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- 1225-8024(pISSN)
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- 2288-8403(eISSN)
Pb-FREE SOLDER PLATING
- Yada, Y. (2nd Development Department, Research Center, Ebara-Udylite Co., Ltd.) ;
- Tokio, K. (2nd Development Department, Research Center, Ebara-Udylite Co., Ltd.)
- 발행 : 1999.06.01
초록
In the future, restrictions are likely to be imposed on the use of lead in the electronics industry. In dealing with such a move, we have been developing Pb-free Sn-Ag plating process to replace presently available Sn-Pb process. In this paper, the result of a basic comparison test between Sn-Pb plating and Sn-Ag plating is reported.