Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)
- Volume 6 Issue 2
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- Pages.1-12
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- 1999
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
Adhesion Strength Measurements of Cu-based Leadframe/EMC Interface
- Lee, Ho-Young (Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology) ;
- Jin Yu (Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology)
- Published : 1999.06.01
Abstract
Brown oxide and/or black oxide layers were formed on the surface of Cu-based leadframe by chemical oxidation of leadframe in hot alkaline solutions, and their growth characteristics were studied. Then, to measure the adhesion strength between leadframe and epoxy molding compound (EMC), oxidized leadframe samples were molded with EMC and machined to form sandwiched double-cantilever beam (SDCB) specimens and pull-out specimens, respectively. Results showed that the adhesion strength of un-oxidized leadframe/EMC interface was inherently very poor but could be increased drastically with the nucleation of acicular CuO precipitates on the surface of leadframe. The presence of smooth faceted
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