Journal of the Korean Vacuum Society (한국진공학회지)
- Volume 8 Issue 3B
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- Pages.340-345
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- 1999
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- 1225-8822(pISSN)
The preparation and characteristics of polyimide for applications as an insulation of semiconductor devices
반도체 소자의 절연막응용을 위한 폴리이미드 박막의 제작과 특성
Abstract
In this paper, polyimide thin films are fabricated by vapor deposition polymerization method appling to the interlayer insulator of semiconductor device, and are investigated in detail. It is found that the packing density and uniformity of films deposited by thermal evaporation are increased according to curing temperature. The resistivity, breakdown strength, relative permitivity, and dielectric loss are
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