Abstract
The ultrafiltration characteristics of wafer processing wastewater produced from semicon¬ductor industry was investigated for wastewater reuse. Using the pilot-scale ultrafiltration system con¬taining poly sulfone hollow fiber membranes (MWCO : 10,000, 20,000, 30,(00), the membrane performance, such as flux, rejection rate and concentration factor for flux was examined. The SDhs, turbidity, electrical conductivity and concentration of Si particles were measured, and the possibility of permeate reuse was validated from the experimental results. It was shown that the flux was recovered by the sweeping with air and water effectively. The permeate flux of 30,000 MWCO membrane was about 5 times higher than that of 10,000 and 20,000 MWCO membranes. The concentration of Si particle in the saw wastewater was analyzed 3.8-5.6 mg/$\ell$ and that of Si particle in the permeate was analyzed less than 0.2${\mu}g$/$\ell$. This means the rejection of silicon particle was over 96%.
반도체 산업의 wafer 가공공정에서 발생하는 폐수를 재활용하고자 한외여과 공정을 이용한 막분리 공정의 도입 가능성을 검토하였다. Pilot 규모의 장치에 분획분자량이 각각 10,000, 20.000, 30,000인 한외여과막 모듈을 이용하여 투과유속 및 제거율 등을 측정하였다. 투과수의 성상은 SDI15, 탁도, 전기전도도, 실리콘 농도분석을 통해 공정수로 재이용이 가능함을 확인할 수 있었다. 투과유속 저하를 막기 위한 역세척 방법으로는 압축공기와 물은 sweeping 하는 방법이 가장 효과적이었고, 이때 투과유속의 회복율이 높게 나타났다. 분획분자량 30,000인 한외여과막에서 가장 높은 투과유속을 나타내었다. 또한 폐수의 평균 실리콘 입자 평균 함량은 3.8-5.6mg/$\ell$이고, 투과수의 실리콘 입자 함량은 0.2${\mu}g$/$\ell$이하로 나타나 제거율은약 96%이상으로 나타났다.
