Effects of cooling rate on Microstructure and Bond Strength in WC-Co/Cu/SM45C steel joint

WC-Co/Cu/SM45C강접합에 미세조직 및 접합강도에 미치는 냉각속도의 영향

  • 정승부 (성균관대학교 금속재료공학부) ;
  • 양훈모 (성균관대학교 금속공학과)
  • Published : 1999.04.01

Abstract

The interfacial microstructure and bond strength were examined for WC-Co/Cu/SM45C steel join using a nickel-plated copper in vacuum at 1323K for 0.6ks∼3.6ks. After bonding, microstructure in bonding interface was observed by OM(Optical Microscopy), SEM(Scanning Electron Microscopy) and EPMA(Eelectron Probe Micro Analyzer). The oil cooling was carried out at 353K, the cooling rate in air and furnace was 22K/s and 4.4K/s. respectively. It was found that dendritic widths increased with the content of cobalt and bonding times at 1323K. As a whole, bond strength values at the same bonding condition decreased in this order: WC-13wt.%Co/SM45Csteel. WC-8wt.%Co/SM45Csteel and WC-4wt.%Co/SM45Csteel. The bond strength of WC-13wt.%Co/S45C steel joint in oil cooling was 273MPa. This value was greatly higher than those of 125MPa in furnace cooling and 93MPa in air cooling at 1323K for 0.6ks. The bond strength values were found to be closely associated with the content of cobalt in WC-Co and cooling rate.

Keywords

References

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