Experimental fabrication of tapped band pass filter of $BiNbO_{4}$ ceramics

$BiNbO_4$ 세라믹스를 이용한 태핑기법의 적층칩 대역 필터에 관한 연구

  • Published : 1998.04.01

Abstract

BN ceramics with 0.07wt% $V_{2}O_{5}$ and 0.03wt% CuO(BNC3V7) sintered at $900^{\circ}C$ where it is possible for these to be co-fired with Ag electrode. Dielectricconstant of 44.3, TCF of 22 ppm$/^{\circ}C$ and $Qxf_{o}$ value of 22,000 GHz can be obtained from BNC3V7, multilayer type band pass filters using tapped method and conventional method were designed for PCS (Personal Communication System) applications. Tapped method by adopting input/output-tapping scheme the chip filter stucture becomes simpler and needs fewer layers than that using the conventional input/output-coupling scheme. A multilayer type band pass filter fabricated by screen-printing with silver electrode after tape casting. The simulated characteristics of the fabricated filters sintered at $900^{\circ}C$ were compared with the designed ones. Even though the centered frequencies of tapped and conventional band pass chaip filters were measured to shift about 90MHz downward, the band pass characteristics of both filters were similar that of designed ones. The spuriousresonance characteristic of tapped pass chip filter was better than that of conventional chip filer.

BN 세라믹에 소결조제로 0.07wt% $V_{2}O_{5}$ 와 0.03wt% CuO을 첨가 하였을 때(BNC3V7) Ag 전극과 동시 소성이 가능한 $900^{\circ}C$ 소결할 수 있었다. 이때 BNC3V7 시편은 유전상수 44.3 $Qxf_{o}$값 22,000 GHz, TCF 값 ppm$/^{\circ}C$의 유전특성을 얻을 수있었다. PCS대역에서 사용 가능한 적층칩 대역 필터를 기존의 방법과 태핑기법에 의한 2가지 방법으로 설계하였다. 입출력 태핑 기법을 이용하여 필터를 제조할 경우 입출력 커플링을 이용한 기존방법에 비해 layer를 감소시킬 수 있어 구조가 간단해진다는 장점이 있다. 적층칩 대역 필터는 Tape casting한 후 Ag전극을 이용하여 Screen printing하여 제작 하였다. 제작된 필터는 $900^{\circ}C$에서 소결하여 설계된 필터와 특성 값을 비교 하였다. 태핑된 칩 필터와 기존 칩 필터 모두 중심주파수는 90MHz 낮은 주파수 대역으로 이동 하였지만 대역 통과 특성은 설계 값과 유사 하였다. 태핑된 칩 필터의 스퓨리어스 특성은 기존 칩 필터에 비해 향상되었다.

Keywords

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