References
- J. Appl. Phys. v.61 S.Prawer;R.Kalish;M.Adel;V.Richter
- J. Vac. Sci. Tech. v.A4 V.J.Kooper;M.J.Mirtich;B.A.Banks
- Appl. Phys. Commu. v.5 T.Datta;J.A.Woolam;W.Notohamiprodjo
- IBM J. Res. Develop. v.34 A.Grill;B.S.Meyerson;V.V.Patel
- J. Appl. Phys. v.59 J.Wagner;P.Lautenschlager
- Appl. Phys. Lett. v.51 S.Matsumoto;M.Hino;T.Kobayashi
- J. Mat. Res. v.5 M.Rubin;C.B.Hoppr;N.H.Cho;B.Bhushan
- J.Appl. Phys. v.61 S.C.Kuo;E.E.Kunhardt;A.R.Srivatsa
- Appl. Phys. Lett. v.53 S.S.Wagel;E.M.Juengerman;C.B.Collins
- Thin Solid Films v.80 K.Enke
- J. Vac. Sci. Tech v.A9 G.V.Vandentop;M.Kawasaki;K.Kobai-sashi;G.A.Somorjai
- Phys. Res v.B30 D.Beeman;J.Silverman;R.Lynd;M.R.Anderson
- J. Appl. Phys v.54 no.8 A.Bubenzer;B.Dischler;G.Brandt;P.Koidl
- Thin Solid Films v.7 M.Morgan