Properties of the Pt Thin Etching in $BCI_3/CI_2$gas by Inductive Coupled Plasma

ICP에 의한 $BCI_3/CI_2$플라즈마 내에서 Pt 박막의 식각 특성

  • 김창일 (중앙대학교 전자전기공학부) ;
  • 권광후 (한서대학교 전자공학과)
  • Published : 1998.10.01

Abstract

The inductively coupled plasma(ICP) etching of platinum with BCl$_3$/Cl$_2$ gas chemistry has been studied. X-ray photoelectron spectroscopy (XPS) was used to investigate the chemical binding states of the etched surface. The plasma characteristics was extracted from optical emission spectroscopy (OES) and a single Langmuir probe. In this case of Pt etching using BCl$_3$/Cl$_2$ gas chemistries, the result of OES and Langmuir probe showed the increase of Cl radicals and ion current densities in the plasmas with increasing Cl$_2$ gas ratio. At the same time, XPS results indicated that the intensities of Pt 4f decreased with increasing Cl$_2$ gas ratio. The decrease of Pt 4f intensities implies the increase of residue layer thickness on the etched Pt surface.

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References

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