References
- The effect of pretinning on the solderability of copper A.J. Sunwoo;H. Hayashigatani;J.W. Morris;G.K. Lucey
- Scripta Metallurgica et Materialia v.31 no.4 Effects of Sn content of Pb-Sn solder alloys on wetting dynamics X.H. Wang;H. Conrad
- Materials Science and Technology v.3 Surface tension of some Sn-Pb alloy-Part 1: Effect of Bi, Sb, P, Ag, and Cu on 60Sn-40Pb solder M.A. Carroll;M.E. Warwick;M.E.
- Journal of Chemical and Engineering Data v.23 no.4 Surface tension and density of liquid tinlead solder alloys A.E. Schwaneke;W.L. Falke;V.R. Miller
- Metallurgical Transactions v.2 no.12 The surface tensions of Pb, Sn, and Pb-Sn alloys D.W.G. White
- Journal of Electronic Packaging Finite element modeling of 3-dimesional solder joint geometry in SMT T.S. Lee;T.P. Choi;C.D. Yoo
- Pan Pacific Microelectronics Symposium Development of CAD tools for pad and metal mask design in SMT T.S. Lee;T.P. Choi;C.D. Yoo;B.C. Koh
- 대한용접학회지 v.14 no.2 3차원 납 접합부 형상을 이용한 표면실장기술의 적정 납량 결정 김성관;최동필;유중돈
- Advances in Electronic Packaging v.10 no.2 Optimizing the reliability of thin small outline package solder joints, EEP R. Darveaux
- Solder joint reliability-theory and applications J.H. Lau
- 유한요소 모델링을 이용한 Gullwing 리드의 3차원 솔더 접합부 형상 예측 v.16 no.4 최동필;유중돈;이태수
- Journal of the Institute of Metals v.95 Wetting of solid-metal surface by molten metals R.J.Klein Wassink
- Journal of Electronic Packaging, ASME v.118 Dynamic aspects of wetting balance tests K.W. Moon;W.J. Boettinger;M.E. Williams;D. Josell
- Welding Journal v.65 no.6 Solderability testing of Kovar with 60Sn-40Pb solder and organic fluxes P.T. Vianco;F.M. Hosking;J.A. Rejent
- Quarterly Journal of Japan Welding Society v.15 no.4 Measurement of surface tension with wetting balance M. Miyazaki;M. Mizutani;T. Takemoto;A. Matsunawa
- Journal of Electronic Packaging, ASME v.114 no.3 Thermal effects during infrared solder reflow-Part Ⅱ A model of the reflow process M. Eftychiou;T.L. Bergman;G.Y. Masada
- Quarterly Journal of Japan Welding Society v.15 no.4 Wettability of Cu and Cu-Sn intermetallic compound by Sn-Pb solder alloy H. Takao;N. Yamamoto;H. Hasegawa
- Acta Metallurgica v.45 no.5 Prediction of interface reaction products between Cu and various solder alloys by thermodynamic calculation B.J. Lee;N.M. Hwang;H.M. Lee
- The Journal of Physical Chemistry v.78 no.12 Wetting under chemical equilibrium and non-equilibirum conditions I.A. Aksay;C.E. Hoge;J.A. Pask
- Metallurgy of welding(5th ed.) J.F. Lancaster
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology v.14 no.3 Palladium as a lead finish for surface mount integrated circuit packages D.C. Abbott;R.M. Brook;N. McLelland;J.S. Wiley
- Bulletin of Alloy Phase Diagrams v.11 no.3 The Cu-Sn system N. Saunders;A.P. Miodownik
- International Metals Reviews v.28 no.4 Energetics of solid/liquid interfaces of metals and alloys N. Eustathopoulos
- Quarterly Journal of Japan Welding Society v.11 no.3 Interface structure at wetting tip of molten Sn-Pb alloy on pure Cu plate : Part Ⅱ K. Sasabe;O. Ohashi