Korean Journal of Air-Conditioning and Refrigeration Engineering (설비공학논문집)
- Volume 9 Issue 4
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- Pages.497-503
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- 1997
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- 1229-6422(pISSN)
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- 2465-7611(eISSN)
A study on the application of heat pipe to the cooling of ATM switching system
전자교환시스템 냉각을 위한 히트파이프 적용 연구
Abstract
In the present study, the cooling package using the heat pipe has been developed to improve the thermal performance in the point of cooling characteristics of the electronic chip placed to the subrack being readily assembled and disassembled in ATM switching system. As the preliminary experiments, the cooling performances between a conventional way using a cooling fin and a proposed method applying the heat pipe are compared and analyzed. The cooling performance at a simulated electronic component packaging a heat pipe module is approximately achieved up to
Keywords