한국통신학회논문지 (The Journal of Korean Institute of Communications and Information Sciences)

  • 제22권1호
  • /
  • Pages.12-20
  • /
  • 1997
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  • 1226-4717(pISSN)
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  • 2287-3880(eISSN)
한국통신학회 (The Korean Institute of Commucations and Information Sciences)
권호 표지

고속 시스템에서의 PCB 선로의 SPICE 모델

SPICE models of PCB traces in high-speed systems

  • 발행 : 1997.01.01
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초록

Physical interconnect such as Printed Circuit Board(PCB) traces introduces new challenges for parameter extraction and delay calculation for high-speed system design. PCB traces are dominated by frequency dependent LC propagation which makes precharacterization difficult for all possible configurations. Moreover, simulating the transient behavior of the trace for noise and delay analysis requries the combined used of a variety of models and techniques for efficiently handling lossy, low-loss, frequency dependent, and coupled transmission lines together with lumped elements. In this paper we explain how the frequency dependence caused by ground plane proximity and skin effects can be modeled using the adstracted models. These abstracted (lumped) models are SPICE-compatible and can be simulated in time-domain, along with precharacterized lumped parasitic elements and nonlinear driver and load models.

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참고문헌

  1. Proc. IEEE Int'l. Conf. Computer-Aided Des. Extension of the Asymptotic Waveform Evaluation Technique with the Method of Characteristics J. E. Bracken;V. Raghaven;R. A. Rohrer
  2. Proc. IEEE(Lett.) v.55 Transient Analysis of Lossless Transmission Lines F. H. Branin, Jr.
  3. IEEE Trans. Microwave Th. Rech. v.37 no.12 The Generalized Method of Characteristics for Waveform Relaxation Analysis of Lossy Coupled Transmission Lines F. -Y. Chang
  4. IEEE Trans. Ckt. Sys.-Ⅰ v.39 no.8 Transient Simulation of Nonuniform Coupled Lossy Transmission Lines Characterized with Frequency-Dependent Parameters-Part 1 : Waveform Relaxation Analysis F. -Y. Chang
  5. IEEE Trans. Comp. Aide Design v.11 Selection of Lumped Element Models for Coupled Lossy Transmission Lines T. Dhaene;D. D. Zutter
  6. IEEE Trans. Ckt. Th. v.9 Computer Simulation of Signal Propagation Through a Nonuniform Transmission Line V. Dvorak
  7. IEEE Trans. Ckt. Sys. v.37 no.1 Modeling Simulation of Interconnection Delays and Crosstalks in High-Speed Integrated Circuits D. S. Gao;A. T. Yang;S. M. Kang
  8. PhD. Thesis, Univ. of Texas at Austin Fast Evaluation of VLSI Interconnect Structures Using moment-Maching Methods N. Gopal
  9. Proc. 25th ACM/IEEE Des. Auto. Conf. Improved Methods of Simulating RLC Coupled and Uncoupled Transmission Lines Based on the Method of Characteristics C. V. Gura;J. A. Abraham
  10. IEEE MTT-s Int'l Microwave Symp. Accurate Quasi-Static Model for Conductor Loss in Coplanar Waveguide M. S. Islan;E. Tuncer;D. P. Neikirk
  11. PhD. Thesis, Univ. of Texas at Austin Tim-Domain Macromodels of VLSI System Interconnects S. Y. Kim
  12. Proc. 28th ACM/IEEE Des. Auto. Conf. RICE: Rapid Interconnect Circuit Evaluator C. L. Ratzlaff;N. Gopal;L. T. Pillage
  13. Proc. IEEE Int'l. Conf. Computer-Aided Des. An Impulse-Response Based Linear Time-Complexity Algorithm for Lossy Interconnect Simulation J. S. Roychowdhury;A. R. Newton;D. O. Pederson
  14. IEEE Trans. Ckt. Sys. v.36 no.7 Nonlinear Transient Analysis of Coupled Transmission Lines J. E. Schutt-Aine;R. Mittra
  15. IEEE Microwave and Guided Wave Letters v.2 no.10 Highly Accurate Quasi-Static Modeling of Microstrip Lines over Lossy Substrates E. Tuncer;D. P. Neikirk
  16. IEEE Trans. Microwave Th. Tech. v.12 Transmission Line Properties of Parallel Strips by Conformal Mapping Approximation H. A. Wheeler
  17. Proc. IEEE Int'l Conf. Computer-Aided Des. Delay and Crosstalk Simulation of High-Speed VLSI Interconnects with Nonlinear Terminations D. H. Xie;M. Nakhla