Development of physically based 3D computer simulation code TRICSI for ion implantation into crystalline silicon

  • Son, Myung-Sik (Department of Electronic Engineering, Chung-Ang University) ;
  • Lee, Jun-Ha (CAE, Samsung Electronics Co., LTD) ;
  • Hwang, Ho-Jung (Department of Electronic Engineering, Chung-Ang University)
  • Published : 1997.06.01

Abstract

A new three-dimensional (3D) Monte Carlo ion implantation simulator, TRICSI, has been developed to investigate 3D mask effects in the typical mask structure for ion implantation into crystalline silicon. We present the mask corner and mask size effects of implanted boron range profiles, and also show the calculated damage distributions by applying the modified Kinchin-Pease equation in the single-crystal silicon target. The simulator calculates accurately and efficiently the implanted-boron range profiles under the relatively large implanted area, using a newly developed search algorithm for the collision partner in the single-crystal silicon. All of the typical implant parameters such as dose, tilt and rotation angles, in addition to energy can be used for the 3D simulation of ion implantation.

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