Microstructure and Thermoelectric Properties of n-Type $\textrm{Bi}_{2}(\textrm{Te}_{0.9}\textrm{Se}_{0.1})_3$ Fabricated by Mechanical Alloying and Hot Pressing Methods

기계적 합금화 공정으로 제조한 n형 $\textrm{Bi}_{2}(\textrm{Te}_{0.9}\textrm{Se}_{0.1})_3$ 가압소결체의 미세구조와 열전특성

  • Kim, Hui-Jeong (Dept. of Metallurgical Engineering and Materials Science, Hongik University) ;
  • Choe, Jae-Sik (Dept. of Metallurgical Engineering and Materials Science, Hongik University) ;
  • Hyeon, Do-Bin (Korea Institute of Science and Technology) ;
  • O, Tae-Seong (Dept. of Metallurgical Engineering and Materials Science, Hongik University)
  • 김희정 (홍익대학교 공과대학 금속.재료공학과) ;
  • 최재식 (홍익대학교 공과대학 금속.재료공학과) ;
  • 현도빈 (한국과학기술연구원 금속연구부) ;
  • 오태성 (홍익대학교 공과대학 금속.재료공학과)
  • Published : 1997.01.01

Abstract

$Bi_{2}(Te_{0.9}Se_{0.1})_{3}$ thermoelectric matcrials havc 11et:n fahricxted hy mechanical alloying and hot pressing methods. Microstructure and thermoelectric properties of the hot 11resseii $Bi_{2}(Te_{0.9}Se_{0.1})_{3}$ have been investigated Lvith variations of hot pressing temperature and dopmt atltiition Formation of $Bi_{2}(Te_{0.9}Se_{0.1})_{3}$ alloy powders was completed by mechanical alloying of the as-mixed Ri. Te, arid Sc grmules of ~3.6mm size for 3 hours at ball-to-material weight ratio of 5 : 1. Figure of merit of $Bi_{2}(Te_{0.9}Se_{0.1})_{3}$ was markedly incrcwieti hy hot pressing at temperatures above $450^{\circ}C$, and value of $1.9{\times}10^{-3}/K$ was obtained for the specimen hot pressed at $550^{\circ}C$. With addition of 0.015 wt% Ri as acceptor dopant, figure of merit ol $Bi_{2}(Te_{0.9}Se_{0.1})_{3}$ hot pressed $550^{\circ}C$$2.1{\times}10^{-3}/K$.

기계적 합금화 공정과 가압소결법으로 $Bi_{2}(Te_{0.9}Se_{0.1})_{3}$ 열전재료를 제조하여, 가압소결온도 및 dopant첨가에 따른 미세구조와 열전특성의변화를 연구하였다. 평균 3.6mm 크기의 Bi, Te, Se granule을 볼과 원료금속의 무게비 5:1에서 3 시간 기계적 합금화 하므로써 $Bi_{2}(Te_{0.9}Se_{0.1})_{3}$ 합금분말의 형성이 완료되었다. $Bi_{2}(Te_{0.9}Se_{0.1})_{3}$ 가압소결체의 성능지수는 $450^{\circ}C$ 이상의 온도에서 가압소결시 급격히 증가하였으며, $550^{\circ}C$에서 가압소결한 시편에서 $1.9{\times}10^{-3}/K$의 값을 얻었다. $550^{\circ}C$에서 가압소결한 $Bi_{2}(Te_{0.9}Se_{0.1})_{3}$의 성능지수는 acceptor dopant 인 Bi를 0.015wt %첨가함에 따라 $2.1{\times}10^{-3}/K$로 향상되었다.

Keywords

References

  1. CRC Handbook of Thermoelectrics D. M. Rowe
  2. Thermoelectric Materials and Devices J. B Cadoff;E. Miller
  3. J. Phys. Chem. Solids v.52 H. W. Jeon;H. P. Ha;D. W. Hyun;J. D. Shim
  4. Proc. 9th ICT T. Tokiai;T. Ohta;M. Nosaksa;K. Sugimoto;T. Kajikawa
  5. Proc. 12th ICT F. Fukuda;A. Onodera;H. Haga
  6. Proc. 9th ICT B.A. Cook;B. J. Beaudry;J. L. Harringa;W. J. Barnett
  7. Proc. 12th ICT A. Yanagitani;S. Nishikawa;Y. Kawai;S. Hayashimoto;N. Itoh;T. Kataoka
  8. J. Solid-State Electronis v.15 W. M. Yim;F. D. Rosi
  9. J. Korean Inst. Metals Mater. H. J. Kim;J. S. Choi;D. B. Hyun;T. S. Oh
  10. Canadian J. Phys. v.45 C. H. Champness;W. B. Muir;P. T. Chiang
  11. J. Appl. Phys. v.30 T. C. Harman;J. H. Chan;M. J. Logan
  12. Proc. 12th ICT K. Masui;Y. Kanamitu;S. Hotta;K. Nakayoshi
  13. Proc. 8th ICT I. J. Ohsugi;T. Kojima;H. Kaibe;I. Nishida
  14. J. Appl. Phys. v.68 I. J. Ohsugi;T. I. Kojima;I. A. Nishida
  15. J. Phys. Chem. Solids v.47 J. Horak;K. Cermak;L. Koudelka
  16. Inorg. Mat. v.19 D. M. Gel`fgat;Z. M. Dashevskii
  17. J. Phys. Chem. Solids v.26 G. R. Miller;C.-Y. Li
  18. Thermoelectricity : Science and Engineering R. R. Heikes;R. W. Ure, Jr.
  19. J. Phys. Chem. Solids v.10 F. D. Rosi;B. Abeles;R. V. Jensen