한국표면공학회지 (Journal of the Korean institute of surface engineering)
- 제29권3호
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- Pages.186-194
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- 1996
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- 1225-8024(pISSN)
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- 2288-8403(eISSN)
Sol-Gel법을 이용한 알루미나 기판과 동 피복층간의 접착력 특성
Adhesion characteristics of copper layer fabricated by Sol-Gel process
초록
In this study, ceramic film was coated by a sol-gel process for increasing the adhesion strength between the substrate and copper layer. TEOS and ATSB were used as starting solution of metallic alkoxide. As a result, amorphous-like diffraction pattern after heat treatment at
키워드