References
- Proc. of VHSIC Packaging Workshop B.K.Gilbert;D.J.Schwab;M.I.Samson
- Proc. 37th IEEE Electric components Conf. U.Mohideen;T.R.Gururaja;L.E.Cross;W.Yarborough;A.Das;J.Yamoato;R.Roy
- Am. Ceram. Soc. Bull. v.66 W.Yarborough;T.R.Guraraja;L.E.Cross
- MRS Symp. Proc. v.72 A.Das;R.Messier;T.R.Gururaja;L.E.Cross
- Dielectric Materials and Application A.R.von Hippel
- J. Am. Ceram. Soc. v.73 T.Fujiu;G.L.Messing;W.Huebner
- J. Ceram. Soc. Jpn. v.95 no.2 H.Suzuki;K.Ota;H.Saito
- J. Ceram. Soc. Jpn. v.95 no.2 H.Suzuki;K.Ota;H.Saito
- Sol-Gel Science D.J.Binker;G.W.Scherer
- J. Kor. Ceram. Soc. v.27 no.6 M.H.Han;K.C.Park
- J. Ceram. Soc. Jpn. v.92 M.Sugiura;O.Kamigaito
- J. Ceram. Soc. Jpn. v.96 no.1 H.Suzuki;Y.Tomokiyo;Y.Suyama;H.Saito