Thermal Stress Intensity Factors for Partially Insulated Interface Crack under Uniform Heat Flow

부분 열유동이 있는 접합 경계면균열의 열응력세기계수 결정

Hilbert problems are derived to evaluate thermal stress intensity factors for a partially insulated crack subjected to vertically uniform heat flow in infinite bonded dissimilar materials. In case of fully insulated crack surface, the present solutions of thermal stress intensity factors are reduced into the same as the previous results. For the homogeneous material, mode II thermal stress intensity factor only exists. However, in the bonded dissimilar materials, both mode I and II thermal stress intensity factors are obtained. Specially, in this case, mode II thermal stress intensity factor is dominent. Also, thermal stress intensity factors are strongly influenced by the material properties. Thermal stress intensity factors decrease when the degree of insulation decreases.