Journal of the Korean institute of surface engineering (한국표면공학회지)

The Korean Institute of Surface Engineering (한국표면공학회)
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Effects of Surfactants on Electroless Copper Planting Bath for PCB

PCB제조용 무전해 동도금액에 대한 계면활성제의 영향

  • 이홍기 (한양대학교 공과대학 공업화학과) ;
  • 심미자 (서울시립대학교 문리과대학 생명과학과) ;
  • 김상욱 (서울시립대학교 공과대학 화학공학과) ;
  • 여운관 (홍익대학교 공과대학 금속공학과) ;
  • 이주성 (한양대학교 공과대학 공업화학과)
  • Published : 1993.10.01
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Abstract

The effects of surfactants on electorless copper plating bath for PCB was studied. Basic bath composition was cuplic sulfate 10g/l, EDTA.2Na 40 g/l, formalin$ 3m\ell$/l and sodium hydroxide solution for pH adjust. After addition of accelerators, stabilizers and surfactants, the polarization curves in plating bath were carried out for presumption of the plating rate. From the plating rate in bath with the various concentration of additives, the optimum condition for manufacturing the electroless copper plating bath was confirmed. It was found that the addition of $\alpha$.$\alpha$'-dipyridyl, pyridine and polyxyethylene octylphenylether was good as stabilizer, accelerator and surfactants, respectively. With this additives, the maximum plating rate of $12\mu\textrm{m}$/h at $65^{\circ}C$ and $2\mu\textrm{m}$/h at $25^{\circ}C$ was obtained.

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