한국표면공학회지 (Journal of the Korean institute of surface engineering)
- 제26권4호
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- Pages.175-182
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- 1993
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- 1225-8024(pISSN)
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- 2288-8403(eISSN)
무전해 Ni 도금의 전기화학적 고찰
Electrochemical aspects of electroless nickel-boron plating
초록
Electroless plating of nickel was studied electrochemically in the presence of complexing agents. Nickel sulfate solution with dimethylamine borance(DMAB) as the reducing agent was used. Effects of temperature pH, concentration and complexing agents-citric acid, EDTA, tartaric acid-were studied.Experimental meas-urements showed that the rate of electroless nickel deposition was closely related to electrochemical parame-ters such as temdperature, pH, concentration and the properties of complexing agets.
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