참고문헌
- Ceramics v.18 no.7 Glass 에 의한 電子部品의 保護 河村 勵
- J. Electrochem. Soc v.131 no.2 Surface Charges in a ZnO-B₂O₃-SiO₂ Glass/Silicon System Y. Misawa;H. Hachino;S. Hara;M. Hanazono
- J. Electrochem. Soc. v.131 no.8 Properties of ZnO-B₂O₃-SiO₂Glass for Surface Passivation Yutaka Misawa
- Electronic-Ceramics v.20 no.11 封止用 ガラス 河村 勵
- J. Electrochem. Soc v.134 no.9 Characterization of Zinc Borosilicate Glass/Silicon Interface S. Murakami;K. Miyata;M. Tsuruoka;Y. Kobayashi
- J. Electrochem. Soc. Effect of Additives on ZnO-B₂O₃-SiO₂Passivation Glass Yutaka Misawa
-
Am. Ceram. Soc. Bull.
v.66
no.4
DTA and TMA Compositional Dependence in
$ZnO-SiO_2-B_2O_3-P_2O_5$ and ZnO-SiO₂-B₂O₃-GeO₂ Glass Systems Keiji Kobayashi -
Am. Ceram. Soc. Bull.
v.63
no.11
Low Melting Glasses in the System
$ B_2O_3-ZnO-CaO-P_2O_5$ J.M. Clinton;W.W. Coffen - J. Phys. D. v.7 A Study of Polarization Phenomenon in Lead Silicate Glass Using the MGOS Structure B.R.Singh
- J. Electrochem. Soc. v.130 no.9 Effect of CaO and MgO on Crystallization in Lead Borosilicate Glasses S. Sachdev;R.C. Buchanan
- 東芝 Review v.33 no.9 Glass-passivated Transistors Masato Uchida(et al.)
- 富土時報 v.50 no.3 カラス被服に よる 半導體 素子の表面 安定化 三浦俊二;他
- Solid State Technnology v.19 no.3 Glass Passivation Improves High Voltage Transistors A.H. Berman
- 日時 昭 半導體 被服用 ガラズ 波多野和夫
- Glass Tech. v.8 no.2 Solder Glass Seal in Semiconductor Packaging D.A.W. Forbes
- Am. Ceram. Soc. Bull. v.58 no.6 Crystallization and Thermal Expansion of Solder Glass in the PbO-ZnO-B₂O₃System with Admixtures Y.E. Ravinochi
- J. Am. Ceram. Soc. v.39 no.3 Solder Glass Sealing R.H. Dalton
- Solid State Tech. v.15 no.1 Use of DTA in Controlling Behavier of Solder Glass in the Ceramic Package T.H. Ramsey