A Study on the Microdefect Detection of Semiconductor Package by Digital Ultrasonic Image Processing

디지탈 초음파 화상처리에 의한 반도체 패키지의 미소결함 검출에 관한 연구

Ultrasonic testing is one of the most useful NDT method for detection of microdefect in the opaque materials. Recently, many applications of the ultrasonic techniques have been extended widely in the new field like electron is and advanced materials. From the result of the experiment, we have hardly found out a crack in the internal parts of the resin and a delamination between chip and resin because of poor performance of the system.