A Study on the Lattic Damages and Impurity Depth Profiles of ${BF^+}_2$ Ion Implanted Silicon

${BF^+}_2$ 이온 주입된 실리콘 시료의 격자손상과 불순물 농도분포에 대한 연구

  • 권상직 (한국전자통신연구소 반도체기술지원센터 기술분석실) ;
  • 백문철 (한국전자통신연구소 반도체기술지원센터 기술분석실) ;
  • 차주연 (한국전자통신연구소 반도체기술지원센터 기술분석실) ;
  • 권오준 (한국전자통신연구소 반도체기술지원센터 기술분석실)
  • Published : 1988.03.01

Abstract

A study on the lattice damages and impurity depth profiles have been performed with BF2 ion implanted silicon materials. Electrical measurement, SIMS and TEM analysis techniques were used in order to identify the reverse annealing phenomena, impurity depth profiles and lattice damages. A typical reverse annealing phenomena were shown at the dose of 1x10**15/cm\ulcorner and non-reverse annealing at the dose of 5x10**15/cm\ulcorner This was explained with the formation of the amorphous region at BF2+ ion implantation with high dose. That is, the amorphous reigons were recrystallized centrated at certain regions were measured by SIMS technique. The dislocation loops-like crystalline defects were observed with TEM cross sections, which were formed at the lattice damaged region during annealing process.

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