AN EXPERIMENTAL STUDY OF INTERFACIAL ELEMENTAL TRANSITION IN CERAMO-METAL RESTORATION

도저용 착시 도재-금속 개면에서의 원소이동에 관한 실험적 연구

This study was undertaken to observe the elemental transition of Interface depending on different pretreatment methods, the number of filings, the kinds of porcelain powders and the various alloys in ceramo-metal restoration. The materials used in this study were Pors-on $4^{(R)}$ and Ceramco porcelain powder to compare the differences depending on the pretreatement methods and the number of firings. Ceramco porcelain powder and Vita porcelain powder were used to compare the differences of elemental transition depending on the porcelain powders. The $Parasil^{(R)},\;PGV^{(R)}$ and Pors-on $4^{(R)}$ as Pd-Ag alloy were used to compare the difference of elemental transition depending on the various alloys. The pretreatment methods were : no treatment, treatment under vacuum and air, treatment with 50 % hydrofluoric acid and double heat tretament. The number of firings were 3, 5 and 7 repeated firings All specimens were observed by SEM and concentration of elements were analyzed quantitatively with EPMA The results of this study were obtained as follows : 1. In the groups of air-treatment, concentration of Sn were the highest and widest. A high concentration of In were in the groups of vacuum and air treatment. 2. There were no significant differences in concentration of Sn between the group of vacuum, 5 minutes hydrofluoric acid and double heat treatment. (p>0.05) 3. As the period of time of hydrofluoric acid treatment increased, not only were the trace elements reduced but the main components such as Pd and Ag were also reduced. 4. Concentration of Sn and In increased and diffused with repeated firings but 5 repeated and 7 repeated firings groups had no significant differences. (p>0.05) 5. Sn were more concentrated in the group of Ceramco porcelaion powder than Vita porcelain powder. 6. The higher concentration of trace elements in the alloy, the more increasing concentration of Sn and In in the interface.