한국표면공학회지 (Journal of the Korean institute of surface engineering)
- 제8권2호
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- Pages.1-6
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- 1975
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- 1225-8024(pISSN)
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- 2288-8403(eISSN)
Strip 형 반도체 부품상에 회전음극 방법에 의한 주석도금에 관한 고찰
Rotary Cathode Tin Plating on Strip Type Semiconductors
초록
A novel electroplating process is described and effects of anode lay-out thickness distribution and on platiting rate are discussed. Microphotograhic analysis indicates are compact and less "POROUS " than of barrel and rack. With this process production cost reduction and capacity increase could be achieved by a rate of 60% and 97% respectively, as compared to our present barrel plating process. This process disclose a number of beneficial processes such as color coding system on TO-92 package and development of a new tin bath formula.
키워드