The Effects of Total Nitrogen and Residual Ammonia Contents of Compost on the Yield of Cultivated Mushroom, Agaricus Bisporus

퇴비(堆肥)의 전질소(全窒素)와 암모니아 함량(含量)이 양송이 수량(收量)에 미치는 영향(影響)

  • Published : 1973.12.30

Abstract

Among the factors which affect the mushroom yield, this investigation was aimed to confim the relationship between nitrogen content of rice straw compost and crop yield, residual ammonia content and yield. In this investigation the nitrogen content in dry weight of compost ranged from 1.10 to 2.06% and the residual ammonia content between 0.01 and 0.8% at spawning according to the sources of organic or inorganic nitrogen and the formulas of compost materials. The results obtained are summarized as follows: 1. The relationship between nitrogen content of rice straw compost and mushroom yield was represented by the formula: y=13.95+0.048$(r=0.68^{**})$. 2. Nitrogen content and mushroom yield of compost supplemented with organic nitrogen sources were increased as compared with control or inorganic treatments. 3. The relationship between the residual ammonia content and mushroom yield is represented by the formula: $y=0.38086-0.011948+0.00012x^2(r=-0.75^{**})$. In order to obtain high cropping yield the residual ammonia content at spawning should be below 0.03% (expressed as nitrogen content). 4. Application of ammonium sulfate increased the nitrogen content of compost slightly, but the residual ammonia content was increased considerably and yield decreased. On the other hand, the residual ammonia content of urea treatment was low and increased mushroom yield remarkably.

양송이 수량을 지배하는 여러인자중에서 퇴비의 전질소 함량과 암모니아 잔류량이 양송이 수량에 미치는 영향을 구명하고자 본시험을 실시한 결과 다음과 같은 결론을 얻었다. 1. 퇴비의 전질소 함량과 양송이 수량간에는 y=1395+0.048x$(r=0.68^{**})$의 관계가 있었으며 전질소 함량이 높을수록 암모니아 잔류량도 증가하는 경향이었다. 2. 유기태급원은 무처리나 무기태급원에 비해 퇴비의 전질소가 증가되었으며 수량도 높았다. 3. 퇴비의 암모니아 잔류량과 양송이 수량간에는 $y=0.38086-0.011948x+0.00012x^2(r=-0.75^{**})$의 관계가 있었으며 안전다수확을 위해서는 0.03%(질소함량으로서)를 넘지 않아야 했다. 4. 유안의 사용은 암모니아 잔류량이 높았으며 양송이 수량이 낮은 반면 요소는 그 잔류량이 낮고 수량이 유안에 비해 현저히 높았다.

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