An Experimental Study to Improve Heat Transfer of Epoxy Bond for Flooring Board Floor Adhesives

플로어링보드 바닥 접착제용 에폭시본드의 열전달 향상을 위한 실험적 연구

The higher the addition rate, the less difference in kneading was found. This is because most of the cases are mixed with vinyl gloves by hand when immediately mixed in the field, so there is no problem of mixing dough according to the amount of addition. The mean increase temperature for 20 minutes was 31.6℃ for Plain, 38.1℃ for Al, 33.7℃ for Cu, and 5~7℃ for Al 20% added sample, 38.1℃ for Al 20% added sample, but 36.6℃ for Al 5% added sample. This suggests that it is possible to improve its own heat transferability by adding metal powder to epoxy adhesives.