Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2009.06a
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- Pages.22-22
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- 2009
Microwave Sintering of Silver Thick Film on Glass Substrate
유리기판 위에 Ag 후막의 마이크로웨이브 소결
- Hwang, Seong-Jin (School of Materials Engineering, Inha University) ;
- Veronesi, Paolo (Department of Materials and Environmental Engineering, University of Modena and Reggio Emilia) ;
- Leonelli, Cristina (Department of Materials and Environmental Engineering, University of Modena and Reggio Emilia) ;
- Kim, Hyung-Sun (School of Materials Engineering, Inha University)
- Published : 2009.06.18
Abstract
The silver thick film has been used in many industries such as display, chip, solar cell, automobile, and decoration with conventional heating. The silver thick film is fired with optimal time and temperature. However, decreasing the fabrication time is required due to high production power. Furthermore, there is a problem that silver in electrode is diffused throughout any substrates. For inhibiting the Ag diffusion and long fabrication time we considered a microwave heating. We investigated firing of silver thick film with conventional and microwave heating. The temperature of substrate was measured by thermal paper and the temperature of substrate was under