Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)
- 2009.07a
- /
- Pages.1531_1532
- /
- 2009
A Method of Self-Arranging Solderballs for Packaging by Using Surface Energy Difference and Soldering
표면에너지 차이를 이용한 패키징용 솔더볼 자가정렬 및 솔더링 방법
- Hong, Jang-Won (Department of Electrical Engineering, Korea University) ;
- Chang, Jong-Hyeon (Department of Electrical Engineering, Korea University) ;
- Pak, Jung-Ho (Department of Electrical Engineering, Korea University)
- Published : 2009.07.14
Abstract
This paper presents a method of self-arranging solderballs by using surface energy difference. After evaporating Au which has high surface energy on Si substrates, Teflon passivation layer which has low surface energy was patterned by lift-off process. Droplets formed only on the hydrophilic Au solderball lands by the surface energy difference, not the hydrophobic Teflon surface. Scattered solderballs sticked by themselves to the wetted solderball lands on the tilted substrate. After setting preheating of
Keywords