한국전기전자재료학회:학술대회논문집 (Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference)
- 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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- Pages.270-270
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- 2008
Thermal imprint를 이용한 고밀도 line패턴 형성방법
High density line patterns fabricated by thermal imprint
- Lee, Sang-Moon (Central R&D, Samsung Electro-Mechanics) ;
- Kwak, Jung-Bok (Central R&D, Samsung Electro-Mechanics) ;
- Lee, Hwan-Soo (Central R&D, Samsung Electro-Mechanics)
- 발행 : 2008.06.19
초록
We present details of experimental results in the fabrication of high density line patterns, using imprint technique that can provide a simple and comparatively cost-effective manufacturing means. Barrier array structures for display or interconnects for semiconductor applications were the aims of this study. For pattern fabrication, a polymer layer (Ajinomoto GX-13 dielectric film) with a thickness of 38um that can act as either an insulating or a dielectric layer was laminated on a substrate. Fine tracks were then formed using a patterned stamp under isostatic pressure. The line width was ranged between 10 to 60 mm. A self-assembled monolayer (SAM) of fluorinated alkylchlorosilane [