Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2008.06a
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- Pages.253-253
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- 2008
Thermal stabilities and dynamic mechanical properties of dielectric materials for next generation PCB
- Cho, Jae-Choon (Samsung electro-mechanics Co., LTD, Central R&D Institute, eMD Lab) ;
- Lee, Hya-Young (Samsung electro-mechanics Co., LTD, Central R&D Institute, eMD Lab) ;
- Lim, Sung-Taek (Samsung electro-mechanics Co., LTD, Central R&D Institute, eMD Lab) ;
- Park, Moon-Su (Samsung electro-mechanics Co., LTD, Central R&D Institute, eMD Lab) ;
- Lee, Keun-Yong (Samsung electro-mechanics Co., LTD, Central R&D Institute, eMD Lab) ;
- Oh, Jun-Lok (Samsung electro-mechanics Co., LTD, Central R&D Institute, eMD Lab)
- 조재춘 (삼성전기 중앙연구소 eMD 센터) ;
- 이화영 (삼성전기 중앙연구소 eMD 센터) ;
- 임성택 (삼성전기 중앙연구소 eMD 센터) ;
- 박문수 (삼성전기 중앙연구소 eMD 센터) ;
- 이근용 (삼성전기 중앙연구소 eMD 센터) ;
- 오준록 (삼성전기 중앙연구소 eMD 센터)
- Published : 2008.06.19
Abstract
Recently, high performance microelectronic devices are designed in multi-layer structure in order to make dense wiring of metal conductors in compact size. For making dense wiring of metal conductors, we investigated CTE and peel strength of dielectric materials for next generation PCB. It is an object of this research to develop an epoxy resin composition for an interlayer insulating material exhibiting low CTE and high peel strengnth and making an insulating layer thinner.
Keywords