한국전기전자재료학회:학술대회논문집 (Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference)

한국전기전자재료학회 (The Korean Institute of Electrical and Electronic Material Engineers)
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히트싱크 면적에 따른 IGBT의 열 분포 모델링

Thermal Distribution Modeling of IGBT with heatsink areas

  • Ryu, Se-Hwan (Department of Electrical Engineering, Konkuk University) ;
  • Hong, Jong-Kyoung (Department of Electrical Engineering, Konkuk University) ;
  • Won, Chang-Sub (Department of Electrical Engineering, Konkuk University) ;
  • Ahn, Hyung-Keun (Department of Electrical Engineering, Konkuk University) ;
  • Han, Deuk-Young (Department of Electrical Engineering, Konkuk University)
  • 발행 : 2008.06.19
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초록

As the power density and switching frequency increase, thermal analysis of power electronics system becomes imperative. The analysis provides valuable information on the semiconductor rating, long-term reliability. In this paper, thermal distribution of the Non Punchthroug(NPT) Insulated Gate Bipolar Transistor with heatsink areas has been studied. For analysis of thermal distribution, we obtained results by using finite element simulator, ANSYS and compared with experimental data by thermocam.

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