한국정보통신학회:학술대회논문집 (Proceedings of the Korean Institute of Information and Commucation Sciences Conference)
- 한국해양정보통신학회 2008년도 추계종합학술대회 B
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- Pages.625-627
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- 2008
Vertical Via Transition Using a Coaxial Line for SMT Pad Applications
- 이영철 (목포해양대학교)
- Lee, Young-Chul (Division of Marine Electronics and Communication Engineering, Mokpo National University)
- 발행 : 2008.10.31
초록
In this paper, a vertical via transition using a coaxial line is presented for LTCC SMT package applications. A part of outer conductor is cut off due to overlap between a CPW on PCB and transition. For reduction of radiation and return path, a cap is designed on the top layer. The measured S11 and S21 are -14 and 0.9dB, respectively at 15GHz.