한국소음진동공학회:학술대회논문집 (Proceedings of the Korean Society for Noise and Vibration Engineering Conference)
- 한국소음진동공학회 2008년도 추계학술대회논문집
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- Pages.364-367
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- 2008
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- 1598-2548(pISSN)
플립칩 접합용 초음파 혼의 진동해석
Vibration Analysis of ultrasonic Horn for Flip-Chip Bonding
- 발행 : 2008.11.20
초록
Finite element model and the basic experimental method have been developed to help the design of the transverse ultrasonic horn for flip-chip bonding. With two types of design the horn performance and ultrasonic characteristics are verified by using laser vibrometer. These analysis and experiment results can be the fundamental data for ultrasonic horn design considering the vibration modes and performance.