대한전기학회:학술대회논문집 (Proceedings of the KIEE Conference)

대한전기학회 (The Korean Institute of Electrical Engineers)
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실란 프라이머를 이용한 PDMS-PMMA 접착

A study on PDMS-PMMA Bonding using Silane Primer

  • 김강일 (아주대학교 정보통신대학 전자공학부) ;
  • 박신욱 (아주대학교 정보통신대학 전자공학부) ;
  • 양상식 (아주대학교 정보통신대학 전자공학부)
  • Kim, Kang-Il (Division of electrical & Computer Engineering, College of Information Technology, Ajou University) ;
  • Park, Sin-Wook (Division of electrical & Computer Engineering, College of Information Technology, Ajou University) ;
  • Yang, Sang-Sik (Division of electrical & Computer Engineering, College of Information Technology, Ajou University)
  • 발행 : 2008.07.16
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초록

In this paper, we present surface treatments for achieving bonds between PMMA and PDMS substrates. Silane primer is used for the formation of hydroxyl group on PMMA surfaces. The formed hydroxyl groups enhance the bonding strength of PDMS-PMMA substrates without channel clogging and structure deformation. The bonding strength on the different surface treatments (include oxygen plasma, 3-APTES, and corona discharge) is evaluated to find optimal bonding condition. The maximum bonding strength at the optimal surface treatment is over 300 kPa. The surface treatment using silane primer can be used to the bonding process of Micro-TAS and Lab-on-a-Chip.

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