대한전기학회:학술대회논문집 (Proceedings of the KIEE Conference)
- 대한전기학회 2008년도 제39회 하계학술대회
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- Pages.1464-1465
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- 2008
RF MEMS 스위치 적용을 위한 밀봉성 패키지의 특성 연구
Characteristic study of hermetic package for RF MEMS switch
- Bang, Yong-Seung (Seoul National University) ;
- Kim, Jong-Man (Pusan National University) ;
- Kim, Yong-Sung (Seoul National University) ;
- Kim, Jung-Mu (Chonbuk National University) ;
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Kim, Yong-Kweon
(Seoul National University)
- 발행 : 2008.07.16
초록
In this paper, we compared the mechanical characteristics between LTCC-based RF MEMS packaging structures fabricated using two different types of bonding materials; BCB and gold-tin. The BCB-based packages showed an average shear strength of 32.1 MPa and helium leak rate of
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