A Theoretical Study for the Filling Balance of the Family Mold Using Variable-Runner System

가변 러너 시스템을 이용한 패밀리 금형의 충전밸런스에 관한 이론적 연구

In family mold, defects are frequently occurred by an excessive packing the smaller volume cavity during molding. Although runner size could be optimized by CAE analysis or experimental data, the filling imbalance is hardly avoided in the actual injection molding process by various means. Before this study, we developed a variable-runner system for balancing the cavity-filling for three resins (ABS, LDPE, and PA66) in the family-mold, and examined the effect of cross-sectional area reduction of a runner in the system. In this study, we examined the conditions of the pressure and temperature in the system with a CAE analysis. We also analyzed the influence of the rheological characteristic of resins to the balancing-capability of the system in order to help mold designers easily adopt the variable-runner system to their design.