Proceedings of the Korean Institute of Surface Engineering Conference (한국표면공학회:학술대회논문집)
- 2007.11a
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- Pages.35-35
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- 2007
A Study on the Plasma Treatment for Pb-free Solder Ball for Ball Grid Array Package
BGA 패키지용 무연솔더볼의 플라즈마처리에 관한 연구
- Published : 2007.11.12
Abstract
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