Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2007.06a
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- Pages.359-360
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- 2007
Mechanical Characteristics of Poly 3C-SiC Thin Films
다결정 3C-SiC 박막의 기계적 특성
- Han, Ki-Bong (Univ. of Ulsan) ;
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Chung, Gwiy-Sang
(Univ. of Ulsan)
- Published : 2007.06.21
Abstract
In this paper, the elastic modulus and hardness of poly 3C-SiC thin films growed by APCVD were measured using nanoindentation test. The resulting values of elastic modulus E and hardness H of the poly 3C-SiC film are 305 GPa and 26 GPa, respectively. The mechanical properties of the poly 3C-SiC film are better than bulk Si wafers. Therefore, the poly 3C-SiC thin film is suitable for abrasion resistance, high frequency, and bio MEMS applications.