한국전기전자재료학회:학술대회논문집 (Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference)
- 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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- Pages.303-303
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- 2007
내장형 수동소자의 제조를 위한 포토 이미징 후막리소그라피 기술
Photo-imageable Thick-Film Lithography Technology for Embedded Passives Fabrication
- Lim, Jong-Woo (Korea Institute of Ceramic Engineering and Technology) ;
- Kim, Hyo-Tea (Korea Institute of Ceramic Engineering and Technology) ;
- Kim, Jong-Hee (Korea Institute of Ceramic Engineering and Technology)
- 발행 : 2007.06.21
초록
Photo-imageable thick-film lithography technology was developed for the fabrication of embedded passives such as inductors and capacitors. In this study, photo-imageable dielectric and conductor pastes have apoted a negative type. Sodalime glass wafer, alumina substrate and zero-shrinkage LTCC green tapes were used as substrates. In result, The lithographic patterns were designed as lines and spaces for conductor material, or via-holes for ceramic, LTCC, materials. The scattering and reflection of UV-beam on the substrate had negative effects on fine patterning. The patterning performance was varied with the exposing and developing process conditions, and also varied with the substrate materials. Fine resolution of less then