Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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Thermal Behaviors of Ag Conductive Thick Film with Firing Temperature for Plasma Display Panel

PDP용 Ag 전도성 후막의 열적거동

  • 황성진 (인하대학교, 신소재공학과) ;
  • 이상욱 (인하대학교, 신소재공학과) ;
  • 김형순 (인하대학교, 신소재공학과)
  • Published : 2007.06.21
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Abstract

Ag conductive thick film has been used in bus and address electrodes of PDP (Plasma display panel). In PDP fabrication, the firing temperature of electrode is normally $550{\sim}580^{\circ}C$. For the application of PDP industry, we investigated an Ag conductive thick film with firing temperature. Low melting glass frit was used in the conductive thick film. The thermal properties of Ag and frit were determined by a hot stage microscopy. Based on the our results, we suggest that the Ag conductive thick film should be considered of the firing temperature which is correlated to the shrinkage, conductivity, and shape of thick film.

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