Lifetime improvement of Organic Light Emitting Diode by Using LiF Thin Film and UV Glue Encapsulation

  • Hsieh, Huai-En (Graduate School of Optoelectronics Engineering , National Yunlin University of Science & Technology) ;
  • Huang, Bohr-Ran (Graduate School of Optoelectronics Engineering , National Yunlin University of Science & Technology) ;
  • Juang, Fuh-Shyang (Institute of Electro-Optical and Materials Science, National Formosa University) ;
  • Tsai, Yu-Sheng (Institute of Electro-Optical and Materials Science, National Formosa University) ;
  • Chang, Ming-Hua (Material and Chemical Research Laboratories, Industrial Technology Research Institute (ITRI)) ;
  • Liu, Mark.O. (Material and Chemical Research Laboratories, Industrial Technology Research Institute (ITRI)) ;
  • Su, Jou-yeh (Material and Chemical Research Laboratories, Industrial Technology Research Institute (ITRI))
  • Published : 2007.08.27

Abstract

Before the ultra-violet glue encapsulation, the research evaporated LiF thin film on device surface to be the extra packaging layer for improving the lifetime of organic light-emitting diode. The formula of UV glue was specially developed. We found 100 nm LiF is the optimum thickness. The best lifetime obtained by using LiF and special UV glue is 2.4 times longer than those by commercial UV glue.

Keywords