한국정보디스플레이학회:학술대회논문집
- 2007.08b
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- Pages.1112-1115
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- 2007
In-situ optical thickness & easy packing density measurements as novel approach to development of OLED
- Kim, Mu-Gyeom (Samsung Advanced Institute of Technology) ;
- Kim, Sang-Yeol (Samsung Advanced Institute of Technology) ;
- Lee, Sung-Hun (Samsung Advanced Institute of Technology) ;
- Song, Jung-Bae (Samsung Advanced Institute of Technology) ;
- Park, Sang-Hun (Samsung Advanced Institute of Technology) ;
- Son, Jhun-Mo (Samsung Advanced Institute of Technology) ;
- Kang, Sung-Kee (Samsung Advanced Institute of Technology) ;
- Tamura, Shinichiro (Samsung Advanced Institute of Technology)
- Published : 2007.08.27
Abstract
Optical thickness method using double interferometer showed dynamic variations of both mechanical and optical thicknesses. Packing density measured a thickness ratio of before and after pressed single film. Lower swelled thickness of emitting layer in a device and densely packed film had shown better lifetime.