A Study on Thermal Performance of Microchannel Waterblock for Cooling of CPU in Desktop

컴퓨터 CPU 냉각용 미세채널 워터블록의 열성능에 관한 연구

The microchannel waterblock has a good capability in the cooling of electronic devices. The object of this paper is to study on thermal performance of microchannel water block for cooling of CPU in desktop. The effects of header shape, liquid flow rate, and inlet temperature on the thermal performances of microchannel waterblock are investigated experimentally. Three types of waterblock with different header shape are manufactured from the micro milling and brazing processing. The experiments are conducted using water, over a liquid flow rate ranging from 0.7 to 2.0 LPM and inlet temperature ranging from 20 to $35^{\circ}C$. Waterblocks are attached both horizontally and vertically on the test section to anticipate a performance of waterblock under the actual state in computer. The base temperature and thermal resistance decrease with increasing of liquid flow rate. It was found that the sample #1 was appropriate for the prototype of liquid cooling system.