대한전기학회:학술대회논문집 (Proceedings of the KIEE Conference)
- 대한전기학회 2007년도 제38회 하계학술대회
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- Pages.1504-1505
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- 2007
유기 패키징 기판에서의 BTO 기반의 임베디드 MIM 커패시터의 특성 분석
Characterization of BTO based MIM Capacitors Embedded into Organic Packaging Substrate
- Lee, Seung-J. (Micro/Nano Devices & Packaging Lab, Department of Electronic Engineering, Kwangwoon) ;
- Lee, Han-S. (Daeduck Electronics) ;
- Park, Jae-Y. (Micro/Nano Devices & Packaging Lab, Department of Electronic Engineering, Kwangwoon)
- 발행 : 2007.07.18
초록
In this paper, fully embedded high Dk BTO MIM capacitors have been developed into a multi-layered organic package substrate for low cost RF SOP (System on Package) applications. These embedded MIM capacitors were designed and simulated by using CST 3D EM simulators for finding out optimal geometries and verifying their applicability. The embedded MIM capacitor with a size of
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