Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)
- 2007.07a
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- Pages.1305-1306
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- 2007
Surface treatment of Si wafer for solar cell using reactive plasma method
반응성 플라즈마를 이용한 태양전지용 Si기판의 표면 처리
- Park, Byung-Wook (Department of Electrical and Electronic Engineering, Kyungsung University) ;
- Kwak, Dong-Joo (Department of Electrical and Electronic Engineering, Kyungsung University) ;
- Sung, Youl-Moon (Department of Electrical and Electronic Engineering, Kyungsung University)
- Published : 2007.07.18
Abstract
To lower the fabrication cost of silicon solar cells, a surface treatment using a dielectric barrier discharge instead of a wet cleaning technique was examined on electrode surfaces on silicon solar cells. The fill factor obtained through measuring current-voltage characteristics was evaluated, and the treated surface state was characterized by energy-dispersive X-ray. It was found that the dielectric barrier discharge effectively activated the electrode surface and the surface treatment on finger electrodes contributed greatly to improve the fill factor.
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