Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)
- 2007.07a
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- Pages.862-863
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- 2007
The coupling field analysis of a thermal transfer phenomenon by an magnetic field
자계 분포시 열유동 현상 분석을 통한 결합계 해석
- Son, Rak-Won (Hanyang University) ;
- Jang, Kwang-Yong (Hanyang University) ;
- Bae, Jae-Nam (Hanyang University) ;
- Kim, Sung-Ju (Hanyang University) ;
- Choi, Sung-Gil (Ansan College of Technology) ;
- Ju, Lee (Hanyang University)
- Published : 2007.07.18
Abstract
In this article, we researched the characteristics of heat transfer of the bimetal for over-current protection device. Bimetal consists of two metals which have a different thermal expansion coefficient. To analyze the heat transfer characteristics, by using a bimetal which has a single metal, we analyzed the temperature distribution when bimetal acts a switch. As usual, heat source is applied to the bimetal. But, in the over-current protection switch, the current become heat source. So, by using the current as source, we performed the magnetic analysis and thermal analysis together.
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