대한용접접합학회:학술대회논문집 (Proceedings of the KWS Conference)
- 대한용접접합학회 2006년 추계학술발표대회 개요집
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- Pages.205-206
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- 2006
전해도금으로 형성된 Sn 솔더 범프의 신뢰성
Reliability of Electroplated Pure Sn Solder Bumps
- 발행 : 2006.10.19
초록
The microstructural evolutions and shear properties of the pure Sn solder bumps with Ni UBMs were investigated during multiple reflows and high temperature storage(HTS) tests. Only a
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