대한용접접합학회:학술대회논문집 (Proceedings of the KWS Conference)
- 대한용접접합학회 2006년 추계학술발표대회 개요집
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- Pages.184-186
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- 2006
Sn-3Ag-0.5Cu을 적용한 QFP 솔더 접합부의 크립특성에 관한 연구
Creep Characteristic of QFP Solder Joint using Sn-3Ag-0.5Cu
초록
Sn-3Ag-0.5Cu is one of candidate as an alternative approach to conventional lead-tin solder. In order to evaluate that creep characteristic of QFP, we used Sn-3Ag-0.5Cu where the operating temperature is
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